low pressure injection molding
Low pressure injection molding is an innovative manufacturing process that offers a gentler approach to traditional injection molding techniques. Operating at pressures typically ranging from 1 to 100 bar, this technology provides exceptional protection for delicate components while ensuring high-quality encapsulation. The process begins by melting specialized thermoplastic materials at lower temperatures compared to conventional methods, creating a fluid material that flows smoothly around components without causing damage. This technique is particularly valuable in electronics manufacturing, where sensitive components require careful handling. The system utilizes a vacuum-sealed chamber to eliminate air pockets and ensure complete material penetration, resulting in superior product quality and reliability. The technology accommodates various material options, including polyamides and polyesters, making it versatile for different applications. One of its key features is the ability to process temperature-sensitive components without risk of thermal damage, making it ideal for manufacturing electronic assemblies, medical devices, and automotive components. The process also allows for complex geometries and intricate designs while maintaining structural integrity and environmental protection.